Multilayer Capacitor

Abstract

A multilayer capacitor includes a first grounding internal electrode including a first grounding electrode having a lead-out part led to one side surface of a stacked body, and a second grounding electrode having a lead-out part led to the other side surface; a second grounding internal electrode including a third grounding electrode which overlaps the first grounding electrode and has a lead-out part led to the other side surface, and a fourth grounding electrode which overlaps the second grounding electrode and has a lead-out part led to one side surface; and a signal internal electrode disposed between the first and second grounding internal electrodes, wherein the first and second grounding electrodes and the third and fourth grounding electrodes have, at their adjacent opposed sides, corners curved as seen in a plan view in the stacking direction, respectively, the corners being each located opposite to the corresponding lead-out part.

The invention claimed is: 
     
       1. A multilayer capacitor, comprising:
 a stacked body which is composed of a stack of a plurality of dielectric layers and has a pair of principal surfaces, a pair of side surfaces, and a pair of end faces, the stacked body being of a form of rectangular parallelepiped; 
 a first grounding internal electrode including a rectangular first grounding electrode having a lead-out part led to one of the pair of side surfaces and a rectangular second grounding electrode having a lead-out part led to the other one of the pair of side surfaces, the rectangular first grounding electrode and the rectangular second grounding electrode being disposed side by side along the pair of side surfaces within one and a same plane in the stacked body; 
 a second grounding internal electrode including a rectangular third grounding electrode which is positioned so as to overlap the first grounding electrode in a stacking direction, and has a lead-out part led to the other one of the pair of side surfaces, and a rectangular fourth grounding electrode which is positioned so as to overlap the second grounding electrode in the stacking direction, and has a lead-out part led to one of the pair of side surfaces, the rectangular third grounding electrode and the rectangular fourth grounding electrode being disposed side by side along the pair of side surfaces within one and the same plane in the stacked body; 
 a rectangular first signal internal electrode disposed between the first grounding internal electrode and the second grounding internal electrode so as to confront the first grounding internal electrode and the second grounding internal electrode in the stacking direction, the rectangular first signal internal electrode being led to at least one of the pair of end faces of the stacked body; 
 first to fourth grounding external terminals which are each disposed on corresponding one of the pair of side surfaces of the stacked body and are connected with corresponding one of the lead-out parts, respectively, of the first to fourth grounding electrodes; and 
 a pair of signal external terminals which are each disposed at corresponding one of the pair of end faces of the stacked body and are connected with the first signal internal electrode, 
 the first grounding internal electrode having corners curved as seen in a plan view in the stacking direction, and the second grounding internal electrode having corners curved as seen in a plan view in the stacking direction, the corners of the first grounding internal electrode being at adjacent opposed sides of the rectangular first and second grounding electrodes, the corners being each located on an opposite side to the lead-out part of the rectangular first grounding electrode which is led to one of the pair of side surfaces and to the lead-out part of the rectangular second grounding electrode which is led to the other one of the pair of side surfaces, the corners of the second grounding internal electrode being at adjacent opposed sides of the rectangular third and fourth grounding electrodes, the corners being each located on an opposite side to the lead-out part of the rectangular third grounding electrode which is led to one of the pair of side surfaces and to the lead-out part of the rectangular fourth grounding electrode which is led to the other one of the pair of side surfaces. 
 
     
     
       2. The multilayer capacitor according to  claim 1 ,
 wherein, the first grounding internal electrode has corners curved as seen in a plan view in the stacking direction, and the second grounding internal electrode has corners curved as seen in a plan view in the stacking direction, the corners of the first grounding internal electrode being at adjacent opposed sides of the rectangular first and second grounding electrodes, the corners being located on a same side as the lead-out part of the rectangular first grounding electrode which is led to one of the pair of side surfaces and as the lead-out part of the rectangular second grounding electrode which is led to the other one of the pair of side surfaces, the corners of the second grounding internal electrode being at adjacent opposed sides of the rectangular third and fourth grounding electrodes, the corners being located on a same side as the lead-out part of the rectangular third grounding electrode which is led to one of the pair of side surfaces and as the lead-out part of the rectangular fourth grounding electrode which is led to the other one of the pair of side surfaces. 
 
     
     
       3. The multilayer capacitor according to  claim 1 ,
 wherein, in the first grounding internal electrode, at each of the adjacent opposed sides of the rectangular first and second grounding electrodes, an edge of the lead-out part of the rectangular first grounding electrode which is led to one of the pair of side surfaces coincides with a line of continuation of a side of the rectangular first grounding electrode, as seen in a plan view in the stacking direction, and an edge of the lead-out part of the rectangular second grounding electrode which is led to the other one of pair of the side surfaces coincides with a line of continuation of a side of the rectangular second grounding electrode, as seen in a plan view in the stacking direction, 
 in the second grounding internal electrode, at each of the adjacent opposed sides of the third and fourth grounding electrodes, an edge of the lead-out part of the rectangular third grounding electrode which is led to one of the pair of side surfaces coincides with a line of continuation of a side of the rectangular third grounding electrode, as seen in a plan view in the stacking direction, and an edge of the lead-out part of the rectangular fourth grounding electrode which is led to the other one of the pair of side surfaces coincides with a line of continuation of a side of the rectangular fourth grounding electrode, as seen in a plan view in the stacking direction. 
 
     
     
       4. The multilayer capacitor according to  claim 1 , further comprising:
 a rectangular second signal internal electrode disposed between the first grounding internal electrode or the second grounding internal electrode and one of the pair of principal surfaces of the stacked body in the stacking direction so as to confront the first grounding internal electrode or the second grounding internal electrode in the stacking direction, the rectangular second signal internal electrode being led to at least one of the pair of end faces of the stacked body; and 
 a ground electrode which is disposed on the one principal surface so as to be spaced from the pair of signal external terminals and is electrically connected with the first to fourth grounding external terminals, 
 wherein the ground electrode is opposed to the second signal internal electrode in the stacking direction. 
 
     
     
       5. The multilayer capacitor according to  claim 4 ,
 wherein one end of each of the pair of signal external terminals extends over the one principal surface, and 
 on the one principal surface, a surface of the ground electrode is located outside an end of each of the pair of signal external terminals in the stacking direction. 
 
     
     
       6. The multilayer capacitor according to  claim 4  or  5 ,
 wherein one end of each of the first to fourth grounding external terminals extends over a surface of the ground electrode. 
 
     
     
       7. The multilayer capacitor according to  claim 4 ,
 wherein the ground electrode is configured so that a midportion of the ground electrode protrudes outward beyond one end of each of the first to fourth grounding external terminals in the stacking direction. 
 
     
     
       8. The multilayer capacitor according to  claim 7 ,
 wherein one end of each of the first to fourth grounding external terminals is disposed so as to overlap an end of a surface of the ground electrode. 
 
     
     
       9. The multilayer capacitor according to  claim 4 ,
 wherein the ground electrode is made of an electrically conductive resin material.