Three-dimensional complementary-conducting-strip structure

Abstract

The invention discloses a three-dimensional complementary-conducting-strip (CCS) structure. Some two-dimensional mesh metal layers are stacked vertically and connected mutually via numerous vias to form a three-dimensional network structure, and one or more signal lines with three-dimensional trace style(s) are positioned inside and separated away the three-dimensional network structure. Moreover, each two-dimensional mesh metal layer is a planar metal layer with one or more empty areas. The three-dimensional network structure is grounded, the signal lines(s) is electrically connected to the device(s) and/or terminal(s) respectively, and the dielectric material(s) is used to electrically insulate the signal line(s) from the three-dimensional network structure.

What is claimed is: 
     
       1. A three-dimensional complementary-conducting-strip structure, comprising:
 a plurality of two-dimensional mesh metal layers which are stacked mutually along a direction vertically to a surface of a substrate; 
 a plurality of two-dimensional mesh vias which connect these two-dimensional mesh metal layers along the direction vertical to the surface of the substrate; 
 a plurality of signal line metal layers which stacked mutually along a direction vertically to the surface of the substrate, wherein these signal line metal layers and these two-dimensional mesh metal layers are alternatively stacked; and 
 a plurality of signal line vias which connect these signal line metal layers along the direction vertically to the surface of the surface; 
 wherein each two-dimensional mesh metal layer is a planar metal layer with one or more empty areas, and wherein these two-dimensional mesh metal layers and these two-dimensional mesh vias form a three-dimensional network structure collectively; 
 wherein each signal line metal layer is one or more metal lines parallel to the surface of the substrate; 
 wherein each signal line is separated away other signal lines, and wherein each signal line traces three-dimensionally inside the three dimensional network structure. 
 
     
     
       2. The three-dimensional complementary-conducting-strip structure as claimed in  claim 1 , wherein the three-dimensional network structure is a three-dimensional arrangement of a plurality of unit cells, wherein each unit cell has two neighboring two-dimensional mesh metal layers positioned on two opposite sides of the unit cell along a Z-direction vertical to the surface of the substrate and has two neighboring two-dimensional mesh vias positioned on two opposite sides of the unit cell along an X-direction or a Y-direction parallel to the surface of the substrate. 
     
     
       3. The three-dimensional complementary-conducting-strip structure as claimed in  claim 2 , wherein any unit cell comprises at least one of the following adjustable parameters: X-dimensional signal line size (Sx), Y-dimensional signal line size (Sy), Z-dimensional signal line size (Sz), X-dimensional unit cell period (Px), Y-dimensional unit cell period (Py), Z-dimensional unit cell period (Pz), X-dimensional mesh size (Whx), Y-dimensional mesh size (Why) and Z-dimensional mesh size (Whz). 
     
     
       4. The three-dimensional complementary-conducting-strip structure as claimed in  claim 2 , wherein each unit cell has one or more signal lines positioned inside. 
     
     
       5. The three-dimensional complementary-conducting-strip structure as claimed in  claim 2 , wherein trace styles of these signal lines inside each unit cell have one or more of the following: single line along the horizontal direction, meander line along the horizontal direction, single line along the vertical direction and meander line along the vertical direction. 
     
     
       6. The three-dimensional complementary-conducting-strip structure as claimed in  claim 2 , wherein trace styles of these signal lines inside each unit cell have one or more of the following: two parallel segments along the horizontal direction, two parallel segments along the vertical direction, coupled lines structure along the horizontal direction, coupled lines structure along the vertical direction, two signal lines shuttle alongside along the horizontal direction, two signal lines shuttle alongside along the vertical direction, and three or more signal lines pass through respectively. 
     
     
       7. The three-dimensional complementary-conducting-strip structure as claimed in  claim 2 , wherein shape of these signal lines inside each unit cell comprises at least one of the following: straight line shape, L-like shape, T-like shape, cross shape, five straight lines connected to each other, and six straight lines connected to each other. 
     
     
       8. The three-dimensional complementary-conducting-strip structure as claimed in  claim 1 , wherein these signal lines pass through these empty areas along the direction vertically to the surface of the substrate, and wherein these signal lines pass through gaps between these two-dimensional mesh vias along the direction parallel to the surface of the substrate. 
     
     
       9. The three-dimensional complementary-conducting-strip structure as claimed in  claim 1 , further comprising a plurality of inter-metal dielectric layers, wherein each inter-metal dielectric layer is positioned between a two-dimensional mesh metal layer and a neighboring signal line metal layer. 
     
     
       10. The three-dimensional complementary-conducting-strip structure as claimed in  claim 1 , further comprising at least one of the following:
 the downmost one of these two-dimensional mesh metal layers directly contacts with the substrate; and 
 the downmost one of these signal line metal layers directly contacts with the substrate. 
 
     
     
       11. The three-dimensional complementary-conducting-strip structure as claimed in  claim 1 , further comprising at least one of the following:
 the three-dimensional network structure is grounded; and 
 these signal lines are electrically connected to a plurality of elements and/or terminals positioned in and/or on the substrate respectively. 
 
     
     
       12. A three-dimensional complementary-conducting-strip structure, comprising:
 a three-dimensional network structure which has a plurality of unit cells; and 
 one or more signal lines which traces three-dimensionally inside the three-dimensional network structure; 
 wherein these unit cells are three-dimensionally arranged on a substrate; 
 wherein each unit cell has at least one empty area; 
 wherein these signal lines traces three-dimensionally through these empty areas inside the three-dimensional network unit cell; 
 wherein each unit cell has one or more signal lines; 
 wherein each signal line is separated away the three-dimensional network structure and other signal lines; 
 wherein the three-dimensional network structure has two or more two-dimensional mesh metal layers vertically stacked mutually, wherein each two-dimensional mesh metal layer is a planar metal layer with one or more empty area, and wherein these two-dimensional mesh metal layers are mutually connected by a plurality of two-dimensional mesh vias; 
 wherein each unit cell has two neighboring two-dimensional mesh metal layers positioned on two sides of the unit cell along a Z-direction vertical to the surface of the substrate and has two neighboring two-dimensional mesh vias positioned on two sides of the unit cell along an X-direction or a Y-direction parallel to the surface of the substrate respectively. 
 
     
     
       13. The three-dimensional complementary-conducting-strip structure as claimed in  claim 12 , wherein any unit cell has at least one of the following adjustable parameters: X-dimensional signal line size (Sx), Y-dimensional signal line size (Sy), Z-dimensional signal line size (Sz), X-dimensional unit cell period (Px), Y-dimensional unit cell period (Py), Z-dimensional unit cell period (Pz), X-dimensional mesh size (Whx), Y-dimensional mesh size (Why) and Z-dimensional mesh size (Whz). 
     
     
       14. The three-dimensional complementary-conducting-strip structure as claimed in  claim 12 , wherein trace styles of these signal lines inside each unit cell have one or more of the following: single line along the horizontal direction, meander line along the horizontal direction, single line along the vertical direction and meander line along the vertical direction. 
     
     
       15. The three-dimensional complementary-conducting-strip structure as claimed in  claim 12 , wherein trace styles of these signal lines inside each unit cell have one or more of the following: two parallel segments along the horizontal direction, two parallel segments along the vertical direction, coupled lines structure along the horizontal direction, coupled lines structure along the vertical direction, two signal lines shuttle alongside along the horizontal direction, two signal lines shuttle alongside along the vertical direction, and three or more signal lines pass through respectively. 
     
     
       16. The three-dimensional complementary-conducting-strip structure as claimed in  claim 12 , wherein shape of these signal lines inside each unit cell comprises at least one of the following: straight line shape, L-like shape, T-like shape, cross shape, five straight lines connected to each other, and six straight lines connected to each other. 
     
     
       17. The three-dimensional complementary-conducting-strip structure as claimed in  claim 12 , further comprising at least one of the following:
 all signal lines positioned inside any unit cell is separated from all edges of the unit cell; and 
 dielectric material surrounding the three-dimensional network structure electrically separates the three-dimensional network structure away each of the signal lines. 
 
     
     
       18. The three-dimensional complementary-conducting-strip structure as claimed in  claim 12 , further comprising at least one of the following:
 the three-dimensional network structure is grounded; and 
 these signal lines are electrically connected to a plurality of elements and/or terminals positioned in and/or on the substrate respectively.