Compliant pin fin heat sink and methods

Abstract

A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.

What is claimed is: 
     
       1. A method for forming a compliant heat sink, comprising:
 providing a plurality of layers substantially parallel with a surface of a heat source, where each layer includes a plurality of pin portions spaced apart from each other in a planar arrangement and removable links connecting adjacent pin portions such that a ratio of a width of the pin portions to a width of the links is configured to make the planar sheet flexible either with the links or after removing at least one link; 
 aligning pin portions of adjacent sheets; and 
 bonding the pin portions of the adjacent sheets to form a stack of bonded sheets where the pin portions form columns of pin fins extending transversely from a heat source to heat sink the load. 
 
     
     
       2. The method as recited in  claim 1 , further comprising coupling the pin fins to a compliant sheet to accommodate loads and dimensional differences. 
     
     
       3. The method as recited in  claim 2 , wherein the pin fins are enclosed in an enclosure to guide coolant flow. 
     
     
       4. The method as recited in  claim 2 , wherein the compliant sheet forms a portion of the enclosure. 
     
     
       5. The method as recited in  claim 2 , wherein the compliant sheet contacts a conformable layer of the enclosure. 
     
     
       6. The method as recited in  claim 1 , wherein aligning includes providing a removable handler connected to each sheet to permit handling and alignment of the sheets with other sheets. 
     
     
       7. The method as recited in  claim 1 , further comprising removing at least a portion of the links by at least one of a mechanical process or by etching. 
     
     
       8. The method as recited in  claim 1 , wherein bonding the pin portions includes at least one of thermo-compression, eutectic bonding, soldering and welding.