Printed circuit board and optical module comprising solder resist having no contact with an electro-conductive contact sheet group on a same substrate

Abstract

The application provides a printed circuit board and an optical module so as to alleviate poor contact between the electro-conductive contact sheet group and the clamping piece due to the solder resist. The printed circuit board includes a substrate, and electro-conductive wirings and electro-conductive contact sheet group both laid on the surface of the substrate, where the substrate is overlaid with solder resist, and the solder resist has no contact with the electro-conductive contact sheet group.

The invention claimed is: 
     
       1. A printed circuit board, comprising:
 a substrate, 
 electro-conductive wirings, and 
 an electro-conductive contact sheet group; 
 both the electro-conductive wirings and the electro-conductive contact sheet group are laid on the surface of the substrate, the substrate is overlaid with solder resist, and the solder resist has no contact with the electro-conductive contact sheet group. 
 
     
     
       2. The printed circuit board according to  claim 1 , a thickness of the solder resist is more than a thickness of the electro-conductive contact sheet group. 
     
     
       3. The printed circuit board according to  claim 1 , the electro-conductive wirings laid on the surface of the substrate are overlaid with the solder resist, a thickness of the electro-conductive wirings is almost equal to a thickness of the electro-conductive contact sheet group. 
     
     
       4. The printed circuit board according to  claim 1 , the electro-conductive wirings laid on the surface of the substrate are not overlaid with the solder resist. 
     
     
       5. The printed circuit board according to  claim 1 , a distance between the solder resist and the electro-conductive contact sheet group ranges from 0.6 mm to 1 mm. 
     
     
       6. The printed circuit board according to  claim 5 , the distance between the solder resist and the electro-conductive contact sheet group is almost 0.8 mm. 
     
     
       7. The printed circuit board according to  claim 5 , the electro-conductive contact sheet group comprises a number of electro-conductive contact sheets with a same length, and the distance between the solder resist and the electro-conductive contact sheet group refers to a distance between the solder resist and any one of the electro-conductive contact sheets. 
     
     
       8. The printed circuit board according to  claim 5 , the electro-conductive contact sheet group comprises a number of electro-conductive contact sheets with different lengths, and the distance between the solder resist and the electro-conductive contact sheet group refers to a largest one of distances between the solder resist and the electro-conductive contact sheets. 
     
     
       9. The printed circuit board according to  claim 1 , the solder resist is liquid photoinduced solder resist. 
     
     
       10. The printed circuit board according to  claim 9 , the liquid photoinduced solder resist is green liquid photoinduced solder resist. 
     
     
       11. An optical module, comprising:
 an optical transmitter, 
 an optical receiver, and 
 a printed circuit board; 
 the printed circuit board comprises:
 a substrate, 
 electro-conductive wirings, and 
 an electro-conductive contact sheet group; 
 both the electro-conductive wirings and the electro-conductive contact sheet group are laid on the surface of the substrate, the substrate is overlaid with solder resist, and the solder resist has no contact with the electro-conductive contact sheet group. 
 
 
     
     
       12. The optical module according to  claim 11 , a thickness of the solder resist is more than a thickness of the electro-conductive contact sheet group. 
     
     
       13. The optical module according to  claim 11 , the electro-conductive wirings are overlaid with the solder resist, a thickness of the electro-conductive wirings is almost equal to a thickness of the electro-conductive contact sheet group. 
     
     
       14. The optical module according to  claim 11 , the electro-conductive wirings are not overlaid with the solder resist. 
     
     
       15. The optical module according to  claim 11 , a distance between the solder resist and the electro-conductive contact sheet group ranges from 0.6 mm to 1 mm. 
     
     
       16. The optical module according to  claim 15 , the distance between the solder resist and the electro-conductive contact sheet group is 0.8 mm. 
     
     
       17. The optical module according to  claim 15 , the electro-conductive contact sheet group comprise a number of electro-conductive contact sheets with a same length, and the distance between the solder resist and the electro-conductive contact sheet group refers to a distance between the solder resist and any one of the electro-conductive contact sheets. 
     
     
       18. The optical module according to  claim 15 , the electro-conductive contact sheet group comprise a number of electro-conductive contact sheets with different lengths, and the distance between the solder resist and the electro-conductive contact sheet group refers to a largest one of distances between the solder resist and the electro-conductive contact sheets. 
     
     
       19. The optical module according to  claim 11 , the solder resist is liquid photoinduced solder resist. 
     
     
       20. The optical module according to  claim 19 , the liquid photoinduced solder resist is green liquid photoinduced solder resist.