USD1031026SActiveUtility
Bond pattern for substrate
Est. expiryMar 20, 2038(~11.7 yrs left)· nominal 20-yr term from priority
Inventors:Ray Dennis DriaMichael Joseph PageJoseph Leslie GrolmesScott Alan KingMatthew Steven RitterChristopher Colin Arp
A61F 13/15699A61F 13/15756A61F 13/53A61F 2013/1591A61F 13/55115A61F 2013/51078A61F 13/514A61F 13/511A61F 13/515
91
PatentIndex Score
1
Cited by
107
References
1
Claims
Claims
exact text as granted — not AI-modifiedCLAIM
The ornamental design for the bond pattern for a substrate, as shown and described above.Join the waitlist — get patent alerts
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