USD1059315SActiveUtility

Package structure for a semiconductor element

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Assignee: GANRICH SEMICONDUCTOR CORPPriority: Nov 2, 2022Filed: Apr 27, 2023Granted: Jan 28, 2025
Est. expiryNov 2, 2042(~16.3 yrs left)· nominal 20-yr term from priority
Inventors:Jia-Tay KuoChen WangSheng-Bo WangChiao FuYao-Zhong Liu
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PatentIndex Score
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Cited by
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References
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Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a package structure for a semiconductor element, as shown and described.

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