USD1061464SActiveUtility

Heat sink for memory module

55
Assignee: KINGSTON DIGITAL INCPriority: Sep 28, 2023Filed: Sep 28, 2023Granted: Feb 11, 2025
Est. expirySep 28, 2043(~17.2 yrs left)· nominal 20-yr term from priority
Inventors:Hui-Hsin Lu
55
PatentIndex Score
1
Cited by
13
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a heat sink for memory module, as shown and described.

Join the waitlist — get patent alerts

Track USD1061464S — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.