USD1066274SActiveUtility

Heat sink for memory module

50
Assignee: KINGSTON DIGITAL INCPriority: Nov 2, 2021Filed: Nov 2, 2021Granted: Mar 11, 2025
Est. expiryNov 2, 2041(~15.3 yrs left)· nominal 20-yr term from priority
Inventors:Hui-Hsin Lu
50
PatentIndex Score
1
Cited by
21
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a heat sink for memory module as shown and described.

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