USD1070863SActiveUtility
Heat sink for memory module
Est. expiryDec 20, 2042(~16.4 yrs left)· nominal 20-yr term from priority
Inventors:Hui-Hsin Lu
54
PatentIndex Score
1
Cited by
20
References
1
Claims
Claims
exact text as granted — not AI-modifiedCLAIM
The ornamental design for a heat sink for memory module, as shown and described.Join the waitlist — get patent alerts
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