USD1070863SActiveUtility

Heat sink for memory module

Assignee: KINGSTON DIGITAL INCPriority: Dec 20, 2022Filed: Dec 20, 2022Granted: Apr 15, 2025
Est. expiryDec 20, 2042(~16.4 yrs left)· nominal 20-yr term from priority
Inventors:Hui-Hsin Lu
54
PatentIndex Score
1
Cited by
20
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a heat sink for memory module, as shown and described.

Join the waitlist — get patent alerts

Track USD1070863S — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.