USD1071887SActiveUtility

Composite seal for semiconductor manufacturing device

80
Assignee: VALQUA LTDPriority: Jan 31, 2023Filed: Jul 25, 2023Granted: Apr 22, 2025
Est. expiryJan 31, 2043(~16.5 yrs left)· nominal 20-yr term from priority
Inventors:Nobuhiro YoshidaTamotsu Matsumura
80
PatentIndex Score
6
Cited by
46
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a composite seal for semiconductor manufacturing device as shown and described.

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