USD1076074SActiveUtility

Bond pattern for substrate

Assignee: PROCTER & GAMBLEPriority: Mar 20, 2018Filed: Apr 18, 2024Granted: May 20, 2025
Est. expiryMar 20, 2038(~11.7 yrs left)· nominal 20-yr term from priority
A61F 13/15699A61F 13/15756A61F 13/53A61F 2013/1591A61F 13/55115A61F 2013/51078A61F 13/514A61F 13/511A61F 13/515
85
PatentIndex Score
0
Cited by
114
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for the bond pattern for a substrate, as shown and described.

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