USD1080566SActiveUtility
Heat sink for memory module
Est. expiryFeb 23, 2042(~15.6 yrs left)· nominal 20-yr term from priority
Inventors:Hui-Hsin Lu
33
PatentIndex Score
0
Cited by
16
References
1
Claims
Claims
exact text as granted — not AI-modifiedCLAIM
The ornamental design for a heat sink for memory module as shown and described.Join the waitlist — get patent alerts
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