USD1094488SActiveUtility

Manifold for supplying coolant to components of substrate processing systems

Assignee: LAM RES CORPPriority: Dec 10, 2021Filed: Dec 10, 2021Granted: Sep 23, 2025
Est. expiryDec 10, 2041(~15.4 yrs left)· nominal 20-yr term from priority
28
PatentIndex Score
0
Cited by
24
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a manifold for supplying coolant to components of substrate processing systems as shown and described.

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