USD1115719SActiveUtility

Lower edge ring of a process kit for semiconductor substrate processing

Assignee: APPLIED MATERIALS INCPriority: Jan 19, 2018Filed: Jul 11, 2022Granted: Mar 3, 2026
Est. expiryJan 19, 2038(~11.5 yrs left)· nominal 20-yr term from priority
H10P 72/7616H10P 72/72H01J 37/32715H01J 2237/3344H10P 72/7624H10P 72/70H10P 72/7611H10P 72/7606
74
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Cited by
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References
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Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a lower edge ring of a process kit for semiconductor substrate processing, as shown and described.

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