USD258281SExpiredUtility

Panel board for integrated circuit packages

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Assignee: ELECTRONIC MOLDING CORPPriority: Sep 23, 1977Filed: Sep 23, 1977Granted: Feb 17, 1981
Est. expirySep 23, 1997(expired)· nominal 20-yr term from priority
Inventors:James V. Murphy
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PatentIndex Score
8
Cited by
2
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a panel board for integrated circuit packages, substantially as shown and described.

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