USD288436SExpiredUtility

Frame of dual in line package pads utilized to replace damaged pads on printed circuit boards

34
Assignee: PACE INCORPORATEDPriority: Feb 21, 1984Filed: Feb 21, 1984Granted: Feb 24, 1987
Est. expiryFeb 21, 2004(expired)· nominal 20-yr term from priority
Inventors:Linus E. Wallgren
34
PatentIndex Score
1
Cited by
7
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a frame of dual in line package pads utilized to replace damaged pads on printed circuit boards, as shown and described.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.