USD342721SExpiredUtility

Heat dissipating device for a semiconductor package

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Assignee: ITOH RES & DEVELOPMENT LABORATORY CO LTDPriority: Mar 4, 1992Filed: Aug 21, 1992Granted: Dec 28, 1993
Est. expiryMar 4, 2012(expired)· nominal 20-yr term from priority
Inventors:Akira Itoh
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PatentIndex Score
2
Cited by
14
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a heat dissipating device for a semiconductor package, as shown and described.

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