USD344891SExpiredUtility

Disc package for semiconductor wafers

73
Assignee: EMPAK INCPriority: Feb 3, 1992Filed: Feb 3, 1992Granted: Mar 8, 1994
Est. expiryFeb 3, 2012(expired)· nominal 20-yr term from priority
Inventors:Larry G. Dressen
73
PatentIndex Score
16
Cited by
4
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for the disc package for semiconductor wafers, as shown and described.

Join the waitlist — get patent alerts

Track USD344891S — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.