USD357227SExpiredUtility

Spring clip for retaining thermal contact between an electronic device package and a heat sink

78
Assignee: THERMALLOY INCPriority: Sep 24, 1993Filed: Sep 24, 1993Granted: Apr 11, 1995
Est. expirySep 24, 2013(expired)· nominal 20-yr term from priority
Inventors:Matthew C. Smithers
78
PatentIndex Score
19
Cited by
7
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design disclosed for a spring clip for retaining thermal contact between an electronic device package and a heat sink, as shown and described.

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