USD413315SExpiredUtility
Processor package cover plate for an integrated circuit processor package chipset
Est. expiryDec 22, 2017(expired)· nominal 20-yr term from priority
Inventors:Thomas S. Klinker
41
PatentIndex Score
4
Cited by
21
References
1
Claims
Claims
exact text as granted — not AI-modifiedThe ornamental design for a processor package cover plate for an integrated circuit processor package chipset, as shown and described.
Join the waitlist — get patent alerts
Track USD413315S — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.