USD432097SExpiredUtility

Semiconductor package

90
Assignee: SAMSUNG ELECTRONICS CO LTDPriority: Nov 20, 1999Filed: Jan 24, 2000Granted: Oct 17, 2000
Est. expiryNov 20, 2019(expired)· nominal 20-yr term from priority
Inventors:Young-Hee SongHai-Jeong SohnSe-Yong OhJun-Young Jeon
90
PatentIndex Score
42
Cited by
4
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a semiconductor package, as shown and described.

Join the waitlist — get patent alerts

Track USD432097S — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.