USD459705SExpiredUtility

Semiconductor package

67
Assignee: SHINDENGEN ELECTRIC MFGPriority: Mar 6, 2001Filed: Jun 1, 2001Granted: Jul 2, 2002
Est. expiryMar 6, 2021(expired)· nominal 20-yr term from priority
Inventors:Yoshio YokotaNobuyuki Yokote
67
PatentIndex Score
19
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22
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a semiconductor package, as shown and described.

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