USD471168SExpiredUtility

Heat dissipating RF electronics housing

Assignee: TELETRONICS INTERNATPriority: Jan 7, 2002Filed: Jan 7, 2002Granted: Mar 4, 2003
Est. expiryJan 7, 2022(expired)· nominal 20-yr term from priority
58
PatentIndex Score
14
Cited by
12
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a heat dissipating RF electronics housing, as shown and described.

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