USD509194SExpiredUtility

Thermal module

33
Assignee: ASUSTEK COMP INCPriority: Oct 15, 2003Filed: Dec 31, 2003Granted: Sep 6, 2005
Est. expiryOct 15, 2023(expired)· nominal 20-yr term from priority
Inventors:Chi-Chang LinChih-Yuan ChengHeng Wang
33
PatentIndex Score
2
Cited by
6
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a thermal module, as shown and described.

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