USD563327SExpiredUtility
Resin-packaged optical communication module
Est. expiryAug 17, 2025(expired)· nominal 20-yr term from priority
Inventors:Tomoharu Horio
49
PatentIndex Score
7
Cited by
24
References
1
Claims
Claims
exact text as granted — not AI-modifiedCLAIM
The ornamental design for a resin-packaged optical communication module, as shown and described.Join the waitlist — get patent alerts
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