USD566060SExpiredUtility

Grooves formed around a semiconductor device on a circuit board

64
Assignee: NITTO DENKO CORPPriority: Apr 13, 2005Filed: Oct 11, 2005Granted: Apr 8, 2008
Est. expiryApr 13, 2025(expired)· nominal 20-yr term from priority
Inventors:Tetsuya OhsawaEmiko Tani
64
PatentIndex Score
11
Cited by
16
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.

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