USD568838SExpiredUtility

Grooves formed around a semiconductor device on a circuit board

45
Assignee: NITTO DENKO CORPPriority: May 1, 2006Filed: Nov 1, 2006Granted: May 13, 2008
Est. expiryMay 1, 2026(expired)· nominal 20-yr term from priority
Inventors:Naohiro TeradaKouji KataokaTetsuya OhsawaToshiki Naito
45
PatentIndex Score
4
Cited by
15
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.

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