USD574339SExpiredUtility

Pattern formed on the ground layer of a multilayer printed circuit board

65
Assignee: NITTO DENKO CORPPriority: Jun 24, 2005Filed: Dec 22, 2005Granted: Aug 5, 2008
Est. expiryJun 24, 2025(expired)· nominal 20-yr term from priority
Inventors:Mitsuru HonjoHiroshi YamazakiToshiki Naito
65
PatentIndex Score
14
Cited by
12
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a pattern formed on the ground layer of a multilayer printed circuit board, as shown and described.

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