USD577692SExpiredUtility

Grooves formed around a semiconductor device on a circuit board

45
Assignee: NITTO DENKO CORPPriority: Apr 13, 2005Filed: Feb 19, 2008Granted: Sep 30, 2008
Est. expiryApr 13, 2025(expired)· nominal 20-yr term from priority
Inventors:Tetsuya OhsawaEmiko Tani
45
PatentIndex Score
4
Cited by
12
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for grooves formed around a semiconductor device on a board, as shown and described.

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