USD580895SExpiredUtility

Grooves formed around a semiconductor device on a circuit board

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Assignee: NITTO DENKO CORPPriority: May 1, 2006Filed: Apr 8, 2008Granted: Nov 18, 2008
Est. expiryMay 1, 2026(expired)· nominal 20-yr term from priority
Inventors:Naohiro TeradaKouji KataokaTetsuya OhsawaToshiki Naito
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Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.

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