USD584250SExpiredUtility

Grooves formed around a semiconductor device on a circuit board

Assignee: NITTO DENKO CORPPriority: May 1, 2006Filed: Feb 15, 2008Granted: Jan 6, 2009

Est. expiryMay 1, 2026(expired)· nominal 20-yr term from priority

PatentIndex Score

Cited by

References

Claims

exact text as granted — not AI-modified

CLAIM 
     
       The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.

Join the waitlist — get patent alerts

Track USD584250S — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.