USD585394SExpiredUtility

Groove formed around a semiconductor device on a circuit board

33
Assignee: NITTO DENKO CORPPriority: Apr 13, 2005Filed: Apr 7, 2008Granted: Jan 27, 2009
Est. expiryApr 13, 2025(expired)· nominal 20-yr term from priority
Inventors:Tetsuya OhsawaEmiko Tani
33
PatentIndex Score
1
Cited by
13
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a groove formed around a semiconductor device on a circuit board, as shown and described.

Join the waitlist — get patent alerts

Track USD585394S — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.