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Wireless communication device package

Assignee: SAMSUNG ELECTRONICS CO LTDPriority: Jun 12, 2008Filed: Sep 19, 2008Granted: Aug 11, 2009
Est. expiryJun 12, 2028(~1.9 yrs left)· nominal 20-yr term from priority
Inventors:MA CHO-HYANGSHIN HYUN HO
84
PatentIndex Score
14
Cited by
13
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a wireless communication device package, as shown and described.

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