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Semiconductor wafer processing tape

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Assignee: FURUKAWA ELECTRIC CO LTDPriority: Jul 16, 2008Filed: Jul 16, 2008Granted: Nov 30, 2010
Est. expiryJul 16, 2028(~2 yrs left)· nominal 20-yr term from priority
Inventors:Hiromitsu MaruyamaShuzo TaguchiYasumasa MorishimaShinichi Ishiwata
83
PatentIndex Score
33
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1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a “semiconductor wafer processing tape,” as shown and described.

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