USD689829SActiveUtility

Heat dissipating module of memory

71
Assignee: COMPTAKE TECHNOLOGY INCPriority: Jan 2, 2013Filed: Jan 2, 2013Granted: Sep 17, 2013
Est. expiryJan 2, 2033(~6.5 yrs left)· nominal 20-yr term from priority
Inventors:Wei-Hau ChenChia-Yuan KuLi ChenHsin-An Chen
71
PatentIndex Score
19
Cited by
17
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a heat dissipating module of memory, as shown and described.

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