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Heat insulating unit for substrate processing apparatus

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Assignee: HITACHI INT ELECTRIC INCPriority: Aug 21, 2015Filed: Feb 18, 2016Granted: Jun 6, 2017
Est. expiryAug 21, 2035(~9.1 yrs left)· nominal 20-yr term from priority
Inventors:Hideto TatenoDaisuke Hara
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PatentIndex Score
6
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11
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1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       We claim the ornamental design for a heat insulating unit for substrate processing apparatus, as shown (and described).

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