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Mold for packaging semiconductor light emitting device

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Assignee: SEMICON LIGHT CO LTDPriority: Dec 24, 2015Filed: Jun 24, 2016Granted: Jul 25, 2017
Est. expiryDec 24, 2035(~9.4 yrs left)· nominal 20-yr term from priority
Inventors:Kyoung Min KimSoo Kun JeonEun Hyun Park
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PatentIndex Score
6
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12
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1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a mold for packaging semiconductor light emitting device, as shown and described.

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