USD793618SActiveUtility

Mold for packaging semiconductor light emitting device

38
Assignee: SEMICON LIGHT CO LTDPriority: Dec 24, 2015Filed: Jun 24, 2016Granted: Aug 1, 2017
Est. expiryDec 24, 2035(~9.4 yrs left)· nominal 20-yr term from priority
Inventors:Kyoung Min KimSoo Kun JeonEun Hyun Park
38
PatentIndex Score
2
Cited by
12
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a mold for packaging semiconductor light emitting device, as shown and described.

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