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Packaged semiconductor circuit module

82
Assignee: ROHM CO LTDPriority: Apr 11, 2016Filed: Sep 28, 2016Granted: Sep 5, 2017
Est. expiryApr 11, 2036(~9.7 yrs left)· nominal 20-yr term from priority
Inventors:Katsuhiro Iwai
82
PatentIndex Score
24
Cited by
39
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a packaged semiconductor circuit module, as shown and described.

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