USD822629SActiveUtility

Semiconductor package

Assignee: KYOCERA CORPPriority: Jan 26, 2017Filed: Jul 13, 2017Granted: Jul 10, 2018
Est. expiryJan 26, 2037(~10.5 yrs left)· nominal 20-yr term from priority
42
PatentIndex Score
4
Cited by
38
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a semiconductor package, as shown and described.

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