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Housing for packaging semiconductor light emitting device

41
Assignee: SEMICON LIGHT CO LTDPriority: May 11, 2016Filed: Oct 25, 2016Granted: Oct 9, 2018
Est. expiryMay 11, 2036(~9.8 yrs left)· nominal 20-yr term from priority
Inventors:Kyoung Min KimGye Oul Jeong
41
PatentIndex Score
4
Cited by
20
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a housing for packaging semiconductor light emitting device, as shown and described.

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