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Polishing pad

44
Assignee: EHWA DIAMOND IND CO LTDPriority: Apr 24, 2017Filed: Oct 23, 2017Granted: Jul 2, 2019
Est. expiryApr 24, 2037(~10.8 yrs left)· nominal 20-yr term from priority
Inventors:Jun Seok SonJang Hyuk Ahn
44
PatentIndex Score
5
Cited by
20
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a polishing pad, as shown and described.

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