USD859470SActiveUtility

Interconnecting device for thermal management system

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Assignee: HANGZHOU SANHUA RES INST CO LTDPriority: Jun 29, 2017Filed: Dec 27, 2017Granted: Sep 10, 2019
Est. expiryJun 29, 2037(~10.9 yrs left)· nominal 20-yr term from priority
Inventors:Jianbin ShentuZhi WuYaoyao ZhangLong Lin
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PatentIndex Score
1
Cited by
4
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for an interconnecting device for thermal management system, as shown and described.

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