USD877707SActiveUtility

Semiconductor package

55
Assignee: MITSUBISHI ELECTRIC CORPPriority: Mar 30, 2017Filed: Aug 16, 2017Granted: Mar 10, 2020
Est. expiryMar 30, 2037(~10.7 yrs left)· nominal 20-yr term from priority
Inventors:Hiroshi ItakuraKeitaro YamagishiYoshihiro Akeboshi
55
PatentIndex Score
4
Cited by
21
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a semiconductor package, as shown and described.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.