USD908647SActiveUtility

Semiconductor package

57
Assignee: MITSUBISHI ELECTRIC CORPPriority: Mar 30, 2017Filed: Oct 16, 2019Granted: Jan 26, 2021
Est. expiryMar 30, 2037(~10.7 yrs left)· nominal 20-yr term from priority
Inventors:Hiroshi ItakuraKeitaro YamagishiYoshihiro Akeboshi
57
PatentIndex Score
4
Cited by
49
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a semiconductor package, as shown and described.

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