USD920265SActiveUtility

Integrated circuit package

29
Assignee: CHINA CHIPPACKING TECH CO LTDPriority: Sep 29, 2019Filed: Mar 17, 2020Granted: May 25, 2021
Est. expirySep 29, 2039(~13.2 yrs left)· nominal 20-yr term from priority
Inventors:Yiwei Huang
29
PatentIndex Score
0
Cited by
26
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for an integrated circuit package, as shown.

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