USD937231SActiveUtility

Power semiconductor package

89
Assignee: CREE INCPriority: Apr 6, 2020Filed: Apr 6, 2020Granted: Nov 30, 2021
Est. expiryApr 6, 2040(~13.7 yrs left)· nominal 20-yr term from priority
Inventors:Kuldeep Saxena
89
PatentIndex Score
14
Cited by
47
References
1
Claims

Claims

exact text as granted — not AI-modified
CLAIM 
     
       The ornamental design for a power semiconductor package, as shown and described.

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