Integrated circuit and lead frame assembly

Abstract

An integrated circuit (IC) and lead frame assembly comprises a first TAB segment having a plurality of leads having inner and outer ends. The inner ends are connected to bumps formed in a square pattern adjacent the periphery of the IC. A second TAB segment includes a plurality of leads having inner and outer ends. The inner ends are connected to a second set of bumps formed on the IC inwardly from the first set. The outer ends of the leads on the second TAB segment are connected to traces on the first TAB segment which are interleaved between the leads on the first TAB segment. The outer ends of the traces and leads on the first TAB segment thus connect to all of the IC bumps. This arrangement increases the number of connections which can be made to the IC.

I claim all modifications coming within the spirit and scope of the accompanying claims: 
     
       1. An integrated circuit assembly comprising: a single integrated circuit;   a first set of sequential contact pads mounted on said integrated circuit adjacent the perimeter thereof;   a second set of sequential contact pads mounted on said integrated circuit and spaced inwardly from said first set;   a first lead frame 34 having a plurality of leads and having the inner extremities thereof connected to said first set of sequential contact pads, said first lead frame being substantially contained in a first plane; and   a second lead frame having a plurality of leads and having the inner ends thereof connected to said second set of sequential contact pads, said second lead frame being substantially contained in a second plane and spaced apart from said first lead frame.   
     
     
       2. The integrated circuit assembly of claim 1 wherein said first lead frame includes traces interleaved between said leads and wherein the outer ends of the leads in said second lead frame are connected to the inner extremities of said traces. 
     
     
       3. The integrated circuit assembly of claim 2 wherein the leads in said first lead frame are substantially planar. 
     
     
       4. The integrated circuit assembly of claim 3 wherein said second lead frame leads include a substantially planar portion intermediate the inner and outer lead ends substantially parallel to said first lead frame. 
     
     
       5. The integrated circuit assembly of claim 4 wherein an inner lead end in said second lead frame includes a bend disposed between its connection to one of said contacts and the substantially planar portion of said lead frame. 
     
     
       6. The integrated circuit assembly of claim 5 wherein an outer lead end in said second lead frame includes a bend disposed between its connection to one of said traces and the substantially planar portion of said lead frame. 
     
     
       7. The integrated circuit assembly of claim 1 wherein said first lead frame is mounted on a substantially planar base having a central opening therethrough over which the inner ends of the leads in said first lead frame extend. 
     
     
       8. The integrated circuit assembly of claim 1 wherein said second lead frame is mounted on a substantially planar base having a central opening therethrough over which the inner ends of the leads in said second lead frame extend. 
     
     
       9. An integrated circuit assembly comprising: a single integrated circuit;   a first set of contact pads mounted on said circuit;   a second set of contact pads mounted on said circuit;   a first lead frame comprising a substantially planar array of leads having the inner ends thereof connected to said first set of contact pads;   an opening in the central portion of said array defined by the inner extremities of said leads; and   a second lead frame comprising a substantially planar array of leads and having a plurality of said leads extending through said opening, said second lead frame leads being connected to said second set of contact pads and further being spaced apart from said first lead frame leads.   
     
     
       10. The integrated circuit assembly of claim 9 wherein said first lead frame includes traces interleaved between said leads and wherein the outer ends of the leads in said second lead frame are connected to the inner ends of said traces. 
     
     
       11. The integrated circuit assembly of claim 10 wherein said second lead frame leads include a substantially planar portion intermediate the inner and outer lead ends substantially parallel to said first lead frame. 
     
     
       12. The integrated circuit assembly of claim 11 wherein an inner lead end in said second lead frame includes a bend disposed between its connection to one of said contacts and the substantially planar portion of said lead frame. 
     
     
       13. The integrated circuit assembly of claim 12 wherein an outer lead end in said second lead frame includes a bend disposed between its connection to one of said traces and the substantially planar portion of said lead frame. 
     
     
       14. The integrated circuit assembly of claim 9 wherein said first lead frame is mounted on a substantially planar base having a central opening therethrough over which the inner ends of the leads in said first lead frame extend and through which the inner ends of the leads in said second lead frame extend. 
     
     
       15. The integrated circuit assembly of claim 9 wherein said second lead frame is mounted on a substantially planar base having a central opening therethrough through which the inner ends of the leads in said second lead frame extend. 
     
     
       16. The integrated circuit assembly of claim 9 wherein said first set of contact pads form a substantially rectangular array. 
     
     
       17. The integrated circuit assembly of claim 9 wherein said second set of contact pads form a substantially rectangular array.