Method of using an improved solder to bridge a nonmetallic gap between metallic surfaces, said improved solder, and an improved solder connection to bridge a nonmetallic gap between metallic surfaces

Abstract

An improved solder is provided by imbedding solder with metallized fibers.he improved solder is then used to bridge a nonmetallic gap between two separated metallic surfaces by placing the improved solder on the gap and then applying heat to cause the improved solder to melt and flow and bridge the gap and connect the two separated metallic surfaces.

What is claimed is: 
     
       1. An improved solder comprising solder imbedded with metallic fibers. 
     
     
       2. An improved solder according to claim 1 wherein the metallic fibers are solid metallic fibers. 
     
     
       3. An improved solder according to claim 1 wherein the metallic fibers are metallized nonmetallic fibers. 
     
     
       4. An improved solder according to claim 1 wherein the fiber is composed of any metallic material that the solder will stick to. 
     
     
       5. An improved solder according to claim 4 wherein the fiber is of varying widths and shapes. 
     
     
       6. An improved solder according to claim 4 wherein the fibers are randomly oriented. 
     
     
       7. An improved solder according to claim 4 wherein the fibers are aligned along a preferred axis. 
     
     
       8. An improved solder according to claim 4 wherein the percent of metallic fibers to solder can range from about 1 to about 50 percent by volume. 
     
     
       9. Method of bridging nonmetallic gaps between two separated metallic surfaces using an improved solder comprising solder imbedded with metallized fibers, said method comprising placing the improved solder on the gap and then applying heat causing the improved solder to melt and flow and bridge the gap and connect the two separated metallic surfaces. 
     
     
       10. Method according to claim 9 wherein the metallized fibers are solid metallic fibers. 
     
     
       11. Method according to claim 9 wherein the metallized fibers are metallized nonmetallic fibers. 
     
     
       12. Method according to claim 9 wherein the fiber is composed of any metallized material that the solder will stick to. 
     
     
       13. Method according to claim 12 wherein the fiber is of varying widths and shapes. 
     
     
       14. Method according to claim 12 wherein the fibers are randomly oriented. 
     
     
       15. Method according to claim 12 wherein the fibers are aligned along a preferred axis. 
     
     
       16. Method according to claim 12 wherein the percent of metallized fiber to solder can range from about 1 to about 50 percent by volume. 
     
     
       17. An improved solder connection that bridges nonmetallic gaps between metallic surfaces, said improved solder connection comprising solder imbedded with metallized fibers. 
     
     
       18. An improved solder connection according to claim 17 wherein the metallized fibers are solid metallic fibers. 
     
     
       19. An improved solder connection according to claim 17 wherein the metallized fibers are metallized nonmetallic fibers. 
     
     
       20. An improved solder connection according to claim 17 wherein the fiber is composed of any metallized material that the solder will stick to. 
     
     
       21. An improved solder connection according to claim 20 wherein the fiber is of varying width and shapes. 
     
     
       22. An improved solder connection according to claim 20 wherein the fibers are randomly oriented. 
     
     
       23. An improved solder connection according to claim 20 wherein the fibers are aligned along a preferred axis. 
     
     
       24. An improved solder connection according to claim 20 wherein the percent of metallized fiber can range from about 1 to about 50 percent by volume.