Gold-plated electronic components

Abstract

Gold-plated electronic components are disclosed, as well as a process for producing the same, wherein an alloy of nickel and cobalt or an alloy containing these elements as essential ingredients is used as an undercoat for the gold-plated layer.

What is claimed is: 
     
       1. An electronic component, comprising a member consisting of: a ceramic board substrate having a metallized surface formed thereon;   a metal alloy layer coated on the substrate, the metal alloy layer consisting essentially of nickel and cobalt, wherein the cobalt is contained in an amount of 7 to 40% by weight, wherein the metal alloy layer is formed in a thickness of 0.5 to 5 microns; and   a gold-plated outer surface layer coated on said metal alloy, said gold-plated outer surface layer forming the outer-most surface of the electronic component, wherein the gold-plated outer surface layer is formed in a thickness of .[.0.5.]. .Iadd.1.5 .Iaddend.to 2 microns.   
     
     
       2. The electronic component of claim 1, wherein the balance of said alloy is nickel.